GIGA FORCE

The Fastest Plastic Assembly and Packaging
delivery within 24 hours

Regular Delivery within 5 workdays

More than 1500 square meters clean room production
line equipped with grinding，dicing，die attaching，wire
bonding，molding and marking facilities

Wafer Grinding(DISCO)

Can Grinding 8’’ and 12’’ Wafer

Minimum Thickness Up to 50 um

Wafer Saw(ASM/DISCO)

3” 4” 6” 8” 12” Full Mask, MPW Block;

Substrate Material：Si, Low-k, SiC, Glass ，Ceramic, Sapphire，substrate，Lead flame

Mini Dicing Street≧ 40um;

Monthly Capacity：4000Pcs/month;

U-Shape

HAZ<2um

Minimum Thickness Up to 50 um

12~15um Depth

30-70 um Width

Wafer Grinding & Scribing

Packaging Test