Basic Technology Center

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Failure Analysis Lab was founded in 2016, equipped with advanced and sophisticated precise instruments, brings high quality failure analysis in semiconductors, microelectronics, automotive, medical devices, telecommunications, electronics, aerospace, and computers to our customers

Non-Destructive Analysis
  • 3D Microscope
  • 2D/3D Xray
  • SAT
  • IV curve
Electrical Properties Analysis
  • Probe Station
  • Precise Instrument
Electrical Failure Analysis
  • InGaAs
  • OBIRCH
  • Thermal
  • NanoPrbing
Physical Failure Analysis
  • Chemical Decap
  • Cross Section Polish
  • Grinding
  • Delayering
Sample Inspection
  • SEM
  • FIB
  • TEM
Material Analysis
  • Chemical Element Analysis
  • Crystal Structure Analysis
  • Dopant Concentrtion Analysis
Final Comprehensive Report
  • Testing Data Collection
  • Conclusion
  • SEM Dual Beam FIB FIB CKT